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Comparison of Characteristics of Rapid Thermal and Microwave Annealed Amorphous Silicon Thin Films Prepared by Electron Beam Evaporation and Low Pressure Chemical Vapor Deposition

机译:电子束蒸发和低压化学气相沉积的快速热和微波退火的无定形硅薄膜特性比较

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In this study we use chemical and physical vapor depositions to fabricate amorphous silicon (a-Si) films. We also use traditional rapid thermal annealing (RTA) and advanced microwave annealing (MWA) to activate or crystallize a-Si films and then observe their sheet resistances and crystallization. We discovered, although the cost of films fabricated by electron beam (e-beam) evaporation is relatively lower than by chemical vapor deposition (CVD), the effects of the former method are poorer whether in sheet resistance or film crystallization. In addition, only at the doping layer prepared by CVD can film crystallization degree produced by MWA match RTA.
机译:在这项研究中,我们使用化学和物理气相沉积来制造非晶硅(A-Si)膜。我们还使用传统的快速热退火(RTA)和先进的微波退火(MWA)来激活或结晶A-Si薄膜,然后观察它们的薄层和结晶。我们发现,尽管电子束(电子束)蒸发制造的薄膜成本比通过化学气相沉积(CVD),但是在薄层电阻或薄膜结晶中,前者方法的效果是较差的。另外,仅在CVD制备的掺杂层处,可以通过MWA匹配产生的膜结晶度匹配RTA。

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