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High performance normally-off GaN MOSFETs on Si substrates

机译:Si基板上的高性能常关GAN MOSFET

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The enhancement mode AlGaN/GaN hybrid MOS-HFETs on Si substrates have been demonstrated. The breakdown voltage of over 1.71 kV was achieved by investigating the epitaxial structure. Furthermore, a high integrity SiO_2/Al_2O_3 gate stack has been demonstrated for GaN MOSFETs. The SiO_2 film formed on GaN by the MW-PECVD exhibits good properties compared that by the LP-CVD. Then, by incorporating the advantages of both of SiO_2 with a high insulating characteristics and Al_2O_3 with good interface characteristics, the SiO_2/Al_2O_3 gate stack structure has been employed in GaN MOS devices. It is shown that a low interface state density between gate insulator and GaN, a high breakdown field, and a large charge-to-breakdown by applying 3-nm Al_2O_3 in this structure. The SiO_2/Al_2O_3 gate stack has also been applied to AlGaN/GaN hybrid MOS-HFET and excellent properties with the threshold voltage of 4.2 V and the maximum field-effect mobility of 192 cm~2/Vs are shown in the transistor.
机译:已经证明了Si基板上的增强模式AlGaN / GaN混合MOS-HFET。通过研究外延结构实现超过1.71kV的击穿电压。此外,已经对GaN MOSFET演示了高完整性SiO_2 / AL_2O_3栅极堆叠。通过MW-PECVD在GaN上形成的SiO_2膜表现出良好的性能,并且通过LP-CVD比较。然后,通过将SiO_2两者的优点结合到具有良好界面特性的高绝缘特性和AL_2O_3,SIO_2 / AL_2O_3栅极堆叠结构已经采用在GaN MOS装置中。结果表明,通过在该结构中施加3-nm al_2o_3,栅极绝缘体和GaN,高击穿场和大电荷对击穿之间的低接口状态密度。 SiO_2 / AL_2O_3栅极堆栈还应用于AlGaN / GaN混合MOS-HFET,并且具有4.2V的阈值电压的优异性能,并且在晶体管中示出了192cm〜2 / Vs的最大场效应迁移率。

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