HIGH-DENSITY MICRODISPENSING SOLDER AND ADHESIVES ONTO FHE AND CONFORMAL SUBSTRATE ASSEMBLIES

摘要

With emerging technologies that include flexible hybrid electronics (FHE) and 3D printed electronics, new deposition methods are needed for volumetric control and precision microdispensing of solders and adhesives with geometries under 50 microns. This paper will outline direct digital manufacturing that supports both technologies. Direct Digital Manufacturing is an integrated capability that allows for processing current high-density PCB technology but also supports FHE and 3D printed electronics. This allows for printing area array solder and adhesive dots at a pitch of less than 200 microns and consistency of dot-to-dot volume diameter and volume. In addition to planar substrate technology like PCBs and FHE, DDM also enables the ability to support the non-planar world of 3D printed electronics. In other words, it enables printing high density adhesive and solder dots on doubly curved 3D printed substrates.