THERMAL CYCLING RELIABILITY AND FAILURE MODE OF TWO BALL GRID ARRAY PACKAGES WITH HIGH RELIABILITY Pb-FREE SOLDER ALLOYS

摘要

The thermal fatigue reliability of multiple high reliability solder alloys containing significant additions and various combinations of bismuth (Bi), antimony (Sb), and indium (In) is being evaluated through a major industrial consortia project. The study uses daisy chained test vehicle that includes a 192 pin chip array ball grid array (192CABGA) and an 84 pin thin core BGA (84CTBGA). Thermal cycling is done in accordance with the IPC-9701 attachment reliability guideline using three distinct thermal cycling profiles, 0/100~oC, -40/125°C, and -55/125°C. In two previous papers, the consortia released the thermal cycling results for the 192CABGA fabricated with 5 high reliability alloys from the project test matrix. This paper presents the thermal cycling results for the 84CTBGA fabricated with those 5 alloys. The differences in alloy performance with the two BGA packages are compared using Weibull statistics, microstructural characterization, and failure mode analysis.