SOLDER JOINT INTEGRITY EVALUATION OF BOTTOM TERMINATED COMPONENT (BTC) SUBJECTED TO THERMAL CYCLING

摘要

The introduction of bottom terminated components (BTCs) was a product of surface mount technology (SMT) component style evolution. The low solder joint standoff height of BTC components has led to concern over their solder joint integrity within the IPC Class 3 electronics community. This paper documents an investigation to characterize the solder joint integrity of BTC components, using thermal cycle testing (-55°C to +125°C) in accordance with the IPC-9701 specification, for both tin/lead solder and lead-free solder alloys.