Electronic component for testing the integrity of a soldered joint on a printed circuit board imparts signal impulse to component pin and derives a correlation value from the reflected signal

摘要

An item of electronic test equipment (1.X) on a printed circuit board checks solder joints to component pins (2.X.Y) on the board. A test impulse is generated within a component (1.X) and imparted to a component pin (2.X.Y). A signal reflected from the pin (2.X.1) is placed in an alternating relationship with the test impulse to derive a correlation value R which is then compared with a pre-determined value. Independent claims are included for: (1) an electronic component; (2) a test configuration.