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In-Situ CCVD Grown Graphene Transistors with Ultra-High On/Off-Current Ratio in Silicon CMOS Compatible Processing

机译:原位CCVD在硅CMOS兼容加工中具有超高开/关流比的石墨烯晶体管

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摘要

We invented a novel method to fabricate graphene transistors on oxidized silicon wafers without the need to transfer graphene layers. By means of catalytic chemical vapor deposition (CCVD) the in-situ grown monolayer graphene field-effect transistors (MoLGFETs) and bilayer graphene transistors (BiLGFETs) are realized directly on oxidized silicon substrate, whereby the number of stacked graphene layers is determined by the selected CCVD process parameters. In-situ grown MoLGFETs exhibit the expected Dirac point together with the typical low on/off-current ratios between 16 (hole conduction) and 8 (electron conduction), respectively. In contrast, our BiLGFETs possess unipolar p-type device characteristics with an extremely high on/off-current ratio up to 1x10~7 exceeding previously reported values by several orders of magnitude. We explain the improved device characteristics by a combination of effects, in particular graphene-substrate interactions, hydrogen doping and Schottky-barrier effects at the source/drain contacts as well. Besides the excellent device characteristics, the complete CCVD fabrication process is silicon CMOS compatible. This will allow the usage of BiLGFETs for digital applications in a hybrid silicon CMOS environment.
机译:我们发明了一种新颖的方法,以在氧化的硅晶片编造石墨烯晶体管而不需要转移的石墨烯层。通过催化化学气相沉积(CCVD)的装置原位生长的单层石墨烯场效应晶体管(MoLGFETs)和双层石墨烯晶体管(BiLGFETs)直接氧化的硅衬底,从而堆叠的石墨烯层的数量由所确定的上实现选择CCVD工艺参数。原位生长MoLGFETs连同典型的低分别表现出预期狄拉克点开/关电流比16(空穴传导)和8(电子传导)之间。相比之下,我们的BiLGFETs上/具有单极p型器件的特性,具有极高的截止电流比高达至1×10 -7通过几个数量级超过先前报道的值。我们通过的效果的组合解释改进的器件特性,特别是石墨烯 - 底物相互作用,氢掺杂并且在其源极/漏极触点以及肖特基势垒的影响。除了极好的器件特性,完整的CCVD制造工艺是CMOS硅兼容。这将允许BiLGFETs的在混合硅CMOS数字环境应用的使用情况。

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