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Introducing pinhole magnification by selective etching: application to poly-Si on ultra-thin silicon oxide films

机译:通过选择性蚀刻引入针孔倍率:在超薄氧化硅膜上的应用于Poly-Si

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Carrier selective junctions formed by polycrystalline silicon (poly-Si) on ultra-thin silicon oxide films are currently in the spotlight of silicon photovoltaics. We develop a simple method using selective etching and conventional optical microscopy to determine the pinhole density in interfacial oxide films of poly-Si on oxide (POLO)-junctions with excellent electrical properties. We characterize the selective etching of poly-Si versus ultra-thin silicon oxide. We use test structures with deliberately patterned openings and 3 nm thin oxide films to check the feasibility of magnification by undercutting the interfacial oxide. With the successful proof of our concept we introduce a new method to access the density of nanometer-size pinholes in POLO-junctions with excellent passivation properties.
机译:通过在超薄氧化硅膜上的多晶硅(Poly-Si)形成的载体选择结目前在硅光伏的聚光灯中。我们使用选择性蚀刻和常规光学显微镜进行简单方法,以确定氧化物(POLO)氧化物(POLO)的界面氧化膜中的针孔密度 - 具有优异的电性能。我们表征了聚-SI与超薄氧化硅的选择性蚀刻。我们使用故意图案化的开口和3nM薄氧化膜的测试结构来检查界面氧化物的放大的可行性。随着我们概念的成功证明,我们介绍了一种新方法,可以在具有优异的钝化性能下进入纳米尺寸针孔密度的新方法。

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