首页> 外文会议>Symposium on Dielectric Materials and Metals for Nanoelectronics and Photonics >Surface Preparation and In/Ga Alloying Effects on InGaAs(001)-(2x4) Surfaces For ALD Gate Oxide Deposition
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Surface Preparation and In/Ga Alloying Effects on InGaAs(001)-(2x4) Surfaces For ALD Gate Oxide Deposition

机译:用于ALD栅极氧化物沉积的InGaAs(001) - (2x4)表面的表面制备和In / Ga合金作用

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High resolution STM images of In_(0.53)Ga_(0.47)As(001)-(2x4) were obtained and surface defects were quantified as a function of sample preparation technique. Published STM images of InGaAs(001)-(2x4) samples of varying In composition were examined and missing dimer unit cells, adatom trough defects, and incomplete atomic terraces were quantified for comparison with the In_(0.53)Ga_(0.47)As(001)-(2x4) surface. Density Functional Theory (DFT) modeling of α2(2x4) and β2(2x4) unit cell constructions and electronic structures show that the missing dimer defect creates conduction band edge states not readily passivated by trimethy aluminum; therefore, the density of dimer defects may cause trap state formation at oxide/InGaAs(001) interfaces.
机译:获得了In_(0.53)Ga_(0.47)的高分辨率STM图像作为(001) - (2x4),并作为样品制备技术的函数量化表面缺陷。出版的Ingaas(001) - (2x4)(2x4)在组合物中改变的样品,缺少二聚体单元细胞,缺少二聚体缺陷和不完全的原子梯度,以与IN_(0.53)GA_(0.47)相比(001 ) - (2x4)表面。 α2(2x4)和β2(2x4)单元细胞结构和电子结构的密度函数理论(DFT)建模表明,缺失的二聚体缺陷产生了不容易被三甲基铝钝化的导带边缘状态;因此,二聚体缺陷的密度可以在氧化物/ ingAAs(001)界面处引起陷阱状态形成。

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