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首页> 外文期刊>Journal of Nanoelectronics and Optoelectronics >Comparative Study of Si3N4-PECVD and Al2O3-ALD Surface Passivation in T-Shaped Gate InAlAs/InGaAs InP Based HEMTs
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Comparative Study of Si3N4-PECVD and Al2O3-ALD Surface Passivation in T-Shaped Gate InAlAs/InGaAs InP Based HEMTs

机译:基于T形闸门in inalas / Ingaas INP的Si3N4-PECVD和Al2O3-ALD表面钝化的比较研究

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摘要

Surface passivation has a great impact on the DC and RF performance of HEMTs. In this paper, a comparative study of the DC and RF performance of InAlAs/InGaAs InP HEMTs (with L-g = 100 nm), passivated by Si3N4-PECVD and Al2O3-ALD has been presented. Increase in C-gd and C-gs is significantly limited. After passivation, an increase in g(m.MAX) up to 1160 mS/mm and 1150 mS/mm is observed in both cases. Improvement in the RF performance in case of Si3N4-PECVD is more obvious than Al2O3-ALD. In addition, a small-signal equivalent circuit model has been developed. It provides excellent agreement between measured and simulated results.
机译:表面钝化对DC和RF性能产生了很大的影响。 本文已经提出了由Si3N4-PECVD和Al2O3-ALD钝化的Inalas / InGaAs InP Hemts(用L-G = 100nm)的DC和RF性能的对比研究。 C-GD和C-GS的增加显着限制。 在钝化之后,在两种情况下,在两种情况下观察到高达1160ms / mm和1150ms / mm的G(m.max)增加。 在Si3N4-PECVD的情况下改善RF性能比Al 2 O 3-Ald更明显。 此外,已经开发出小信号等效电路模型。 它在测量和模拟结果之间提供了良好的一致性。

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