Compression molding solutions for wafer level, large panel substrate, and advanced packaging

摘要

There has been great progress in Compression Molding Technology and Equipment. This technology has a wide range of applications. It is used not only for the most advanced semiconductor packages, for wafer level molding, for large substrate molding, for LED's, but also for regular MAP packages with BGA type substrates and QFN's on leadframes to reduce cost and achieve better quality and reliability. The systems have been fully developed and are being sold for mass production. Compression Molding is the next Defacto standard.