GaN/SiC MMICs and packaging for use in future transmit / receive modules

摘要

Future applications like new types of multifunctional sensors (e.g. surveillance radar) will be realised with cost-effective and high yield manufacturing solutions, like high-volume SMD based electronic products. Different package types, e.g. QFN (Quad Flat no-Lead) and ceramic based packages in L/HTCC (Low/High Temperature Cofired Ceramic) technology, mainly used for power devices will be shown and compared. Next generation of GaN (Gallium Nitride) MMICs will cover more functionalities on the same chip. Therefore specific package designs with higher number of RF interfaces are mandatory. Multifunctional MMICs will allow very compact T/R (Transmit/Receive) module designs, and will reduce the number of active devices and packages used in PCB (Printed Circuit Board) based module solutions.