adhesive bonding; carbon nanotubes; contact resistance; glass; integrated circuit interconnections; reliability; C-Si; SiOlt; subgt; 2lt; /subgt; anisotropic conductive adhesive; carbon nanotube bumps; chip on glass application; contact resistance; damp heat tests; glass substrate; interconnection; paper-mediated controlled method; pressure 127.4 MPa; reliability; silicon chip; temperature 170 degC; thermal cycling; time 8 s; Carbon nanotubes; Contact resistance; Glass; Reliability; Resistance heating; Substrates;
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