Encapsulation of the Next Generation advanced Mems Sensor Microsystems

摘要

The needs of ambient intelligence and miniaturization of electronics require extensive integration of semiconductor components such as MEMS and Sensor packages. A MEMS/sensor package needs access to environment, which is a challenge for MEMS or sensor encapsulation. Film Assisted Molding (FAM) technology can meet the demand of the functional area opening in the encapsulation. FAM technology can fulfill the requirement of encapsulation of the next generation advanced MEMS microsystem with low cost and excellent performance. A combination of FAM and wafer level molding enables MEMS/sensor encapsulation with low cost, good quality and high reliability. FE simulations are performed to investigate the film performance for the FAM cycle. The simulation results match the over-molding process quit well.