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Effects of annealing temperature on structure and properties of PLBZT ferroelectric thin films synthesized by sol-gel processing

机译:退火温度对溶胶 - 凝胶加工合成的PLBZT铁电薄膜结构与性能的影响

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[Pb_(0.95)(La_(0.6)Bi_(0.4))_(0.05)][Zr_(0.53)Ti_(0.47)]O_3 (PLBZT) ferroelectric thin films have been synthesized on ITO-coated glass by sol-gel processing. Effects of annealing temperature on structure and properties of PLBZT have been investigated. With the increase of annealing temperature from 500°C to 550°C, the remanent polarization Pr increase slightly to the maximum value of 25.4μC/cm~2 due to the improvement in crystallization of PLBZT films. However, when the annealing temperature is more than 550°C, the pyrochlore phase appear and degrade the Pr of PLBZT thin films. The lowest leakage current density of 1.8×10~(-9) A/cm~2 can be observed in PLBZT thin films when the annealing temperature is 550°C.
机译:[PB_(0.95)(LA_(0.6)BI_(0.4))_(0.05)] [Zr_(0.53)Ti_(0.47)] O_3(PLBZT)通过溶胶 - 凝胶加工在ITO涂层玻璃上合成铁电薄膜。已经研究了退火温度对PLBZT结构和性质的影响。随着500℃至550℃的退火温度的增加,由于PLBZT薄膜结晶的改善,剩余偏振PR由于PLBZT薄膜结晶而略微增加到25.4μC/ cm〜2的最大值。然而,当退火温度大于550℃时,Pyrochlore相出现并降低PLBZT薄膜的PR。当退火温度为550℃时,可以在PLBZT薄膜中观察到1.8×10〜(-9)A / cm〜2的最低漏电流密度。

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