Thermal and Mechanical Properties of Boron-containing Bisphenal-A Formaldehyde Resin composites

摘要

Boron-containing bisphenol-A formaldehyde resin (BBAFR) with different amounts of boron was synthesized from bisphenol-A, formaldehyde solution and boric acid. The fiber-glass reinforced laminates were prepared. The thermal, electric and mechanical properties were determined. The results show that the BBAFR has a better thermal stablitity. The residual rate of BBAFR is 18% at 900°C, which is higher 300°C than ordinary phenolic resin. The tensile strength of BBAFR fiber-glass laminates is higher 19.07 MPa than ordinary phenolic resin fiber-glass laminates. The volume resistivity and surface resistance of BBAFR laminates increased, but the dielectric loss tan δ and dielectric constant ε decreased.