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A self-test and self-repair approach for analog integrated circuits

机译:模拟集成电路的自检和自修复方法

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With the continuous increase of integration densities and complexities, secure integrated circuits (ICs) are more and more required to guarantee reliability for safety-critical applications in the presence of soft and hard faults. Thus, testing has become a real challenge for enhancing the reliability of safety-critical systems. This paper presents a Self-Test and Self-Repair approach which can be used to tolerate the most likely defects of bridging type that create a resistive path between VDD supply voltage and the ground occurring in analog CMOS circuits during the manufacturing process. The proposed testing approach is designed using the 65 nm CMOS technology. We then used an operational amplifier (OPA) to validate the technique and correlate it with post layout simulation results.
机译:随着集成密度和复杂性的连续增加,越来越多地需要安全集成电路(IC),以确保在软硬故障存在下保证安全关键应用的可靠性。 因此,测试已成为提高安全关键系统可靠性的真正挑战。 本文介绍了一种自测和自修复方法,可用于容忍在制造过程中在模拟CMOS电路中产生电阻路径的桥接类型的最可能缺陷。 所提出的测试方法采用65nm CMOS技术设计。 然后,我们使用了运算放大器(OPA)来验证该技术并将其与后布局仿真结果相关联。

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