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A self-test and self-repair approach for analog integrated circuits

机译:模拟集成电路的自检和自检方法

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With the continuous increase of integration densities and complexities, secure integrated circuits (ICs) are more and more required to guarantee reliability for safety-critical applications in the presence of soft and hard faults. Thus, testing has become a real challenge for enhancing the reliability of safety-critical systems. This paper presents a Self-Test and Self-Repair approach which can be used to tolerate the most likely defects of bridging type that create a resistive path between VDD supply voltage and the ground occurring in analog CMOS circuits during the manufacturing process. The proposed testing approach is designed using the 65 nm CMOS technology. We then used an operational amplifier (OPA) to validate the technique and correlate it with post layout simulation results.
机译:随着集成密度和复杂度的不断提高,越来越需要安全集成电路(IC)来保证在存在软故障和硬故障的情况下对安全关键型应用程序的可靠性。因此,测试已成为增强安全关键系统可靠性的真正挑战。本文提出了一种自测和自修复方法,该方法可用于容忍桥接类型最可能的缺陷,这种缺陷在制造过程中在模拟CMOS电路中的VDD电源电压和地之间形成电阻路径。建议的测试方法是使用65 nm CMOS技术设计的。然后,我们使用运算放大器(OPA)对该技术进行了验证,并将其与布局后的仿真结果相关联。

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