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A novel atomic layer deposition method to fabricate economical and robust large area microchannel plates

机译:一种制造经济型大面积微通道板的新型原子层沉积方法

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We demonstrate a cost-effective and robust route to fabricate large-area microchannel plate (MCP) detectors, which will open new potential in larger area MCP-based detector technologies. For the first time, using our newly developed process flow we have fabricated large area (8"x8") MCPs. We used atomic layer deposition (ALD), a powerful thin film deposition technique, to tailor the electrical resistance and secondary electron emission (SEE) properties of large area, low cost, borosilicate glass capillary arrays. The self limiting growth mechanism in ALD allows atomic level control over the thickness and composition of resistive and SEES layers that can be deposited conformally on high aspect ratio capillary glass arrays. We have developed several robust and reliable ALD processes for the resistive coatings and SEE layers to give us precise control over the resistance (106-1010Ω) and SEE coefficient (up to 5). This novel approach allows the functionalization of microporous, insulating substrates to produce MCPs with high gain and low noise. These capabilities allow a separation of the substrate material properties from the amplification properties. Here we describe a complete process flow to produce large area MCPs.
机译:我们展示了一种成本效益和坚固的途径来制造大面积微通道板(MCP)探测器,这将在较大的基于MCP的探测器技术中开辟新的潜力。首次使用我们的新开发的过程流程,我们已经制造了大面积(8“X8”)MCP。我们使用了原子层沉积(ALD),强大的薄膜沉积技术,定制电阻和二次电子发射(见)大面积,低成本,硼硅酸盐玻璃毛细管阵列。 ALD中的自动限制生长机制允许原子水平控制在电阻的厚度和组合物上,并且可以在高纵横比毛细管玻璃阵列上共同地沉积。我们开发了用于电阻涂层的几种稳健和可靠的ALD工艺,并参见层,以使我们对电阻(106-1010Ω)进行精确控制,并参见系数(最多5个)。这种新方法允许微孔,绝缘基板的功能化,以产生具有高增益和低噪声的MCP。这些能力允许从扩增性能分离基材材料。在这里,我们描述了生产大面积MCP的完整过程流程。

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