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Patterning Anodic Porous Alumina with Resist Developers for Patterned Nanowire Formation

机译:图案化阳极多孔氧化铝,具有抗蚀剂显影剂,用于图案化纳米线形成

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Formation of patterned metal and semiconductor (e.g. silicon) nanowires is achieved using anodic aluminum oxide (AAO) templates with porous structures of different heights resulting from an initial step difference made by etching the aluminum (Al) thin film with a photoresist developer prior to the anodization process. This approach allows for the growth of vertically aligned nanowire arrays on a metal substrate, instead of an oriented semiconductor substrate, using an electroplating or a chemical vapor deposition (CVD) process. The vertically aligned metal and semiconductor nanowires defined on a metal substrate could be applied to the realization of vertical 3D transistors, field emission devices, or nano-micro sensors for biological applications.
机译:使用具有通过在初始阶梯差异的不同高度的不同高度的多孔结构来实现图案化的金属和半导体(例如硅)纳米线,由初始阶梯差异蚀刻在铝(Al)薄膜之前用光致抗蚀剂显影剂蚀刻阳极化过程。这种方法允许使用电镀或化学气相沉积(CVD)工艺,允许在金属基板上的垂直对准的纳米线阵列的生长而不是取向的半导体衬底。在金属基板上限定的垂直对准金属和半导体纳米线可以应用于用于生物应用的垂直3D晶体管,场发射装置或纳米微型传感器的实现。

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