Development of MEMS Power Sensor Package

摘要

This paper presents a design and fabrication of advanced MEMS in high power applications. The developed MEMS device is used as a high power sensor for detecting high current applications. We designed and fabricated MxN array of low power MEMS switches to handle high power which are mass actuated by an external magnetic field. The array of MEMS devices has been packaged in a conventional package and testing was performed to validate its operation. The switching time was very compatible with the existing solid state switches with much higher order of power capability.