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Characterization of EUV ADT for 3X nm node DRAM patterning - (PPT)

机译:3x NM节点DRAM图案的EUV ADT的表征 - (PPT)

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摘要

The slit CD uniformity is 3a 2.6 ~ 4.8nm. The effective factors of slit CD uniformity are considered by the uniformity of relative dose intensity, mask CD and aberration. To achieve of 10% CDU of design rule in DRAM device, it's very important that control of slit CD uniformity. To satisfy EUV PPT target proposed by Hynix, aberration could be improved above 100% compared to the current level.
机译:狭缝CD均匀性为3a 2.6〜4.8nm。通过相对剂量强度,掩模CD和像差的均匀性考虑狭缝CD均匀性的有效因素。为了实现DRAM设备中的10%CDU的设计规则,控制狭缝CD均匀性非常重要。为了满足Hynix提出的EUV PPPT目标,与电流水平相比,差距可以提高100%。

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