Test structures and methods for electrical characterization of alignment of line patterns defined with double patterning

摘要

A test vehicle and method for electrical characterization of misalignment, for example resulting from double patterning processes, that enables characterization of patterns on wafers which have finished processing. It includes a structure and method for measurement of a space-sensitive electrical parameter to characterize gaps between features of different sub-patterns on a semiconductor wafer portion, and may further comprise a test structure for measuring feature dimensions.