Effects of multilayer depositions on the EUV printability and DUV inspectability of substrate pit defects - (PPT)

摘要

Substrate pit smoothing performances by ML depositions were investigated. Simulation results show that pits which are smoothed to < ～1.5 nm in depth at ML surface are not printed on the wafer. AFM, M7360, and AIT analyses show that pit smoothing performances by ML depositions are improved with increasing incidence (tilting) angle. A commercial ML blank shows excellent pit smoothing performances. Its DUV inspectability and EUV printability are under investigation. Minimum printable phase defect size should be determined using commercial blanks. Then, we can focus on the controlling of larger phase defects.