Combination of the 3 inspection techniques + wafer review of prior detections is our current best technique to qualify defect density. Defect density of our champion reticle is still (>)13x higher than the "target" of ～0.04 defects/cm~2 And detecting defects by printing is too late. ML-defect repair - Is possible by absorber pattern compensation, but has a limited capability window. Its need must be avoided. Most likely will need to be iterative. Need for AIMS review.
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