The Effect of Force Power Ramping of the Bonding of Large Packages for Heavy Aluminum Wire Bonds - (PPT)

摘要

Wire bonding under-the-hood automotive-electronic packages that use molded lead-frames and pin-terminal connectors become difficult when unseen contaminants and poor rigidity are present. This paper will discuss how force and power ramping can help to reduce the effects of unseen contamination and rigidity problems.