Development of wafer thinning and dicing technology for thin wafer

摘要

Various stress relief and dicing methods are evaluated for 10 to 30μm wafer thickness. DP (Dry Polish) and CMG (Chemical Mechanical Grinding) are the best solution for productivity and quality in wafer thinning. Highest die strength is achieved for the blade dicing and DBG (Dicing Before Grinding) due to the decreased backside chipping in thin wafer. As for DBG, it is necessary to improve the resin adhesive strength of H-WSS (Hard Wafer Support System).