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Wafer Dicing and Thinning

机译:晶圆切块和薄化

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If you had told me seven years ago that the industry would consider spending around $30 million for lithography tools (immersion 193 nm), I would have laughed out loud. That is even truer of tools ranging $50 million (extreme ultraviolet [EUV]), and yet here I sit, looking at the numbers, continually amazed by how much, how far, and how long this industry will spend, go, and wait to extend the frontiers of transistor technology. My vexation comes on the heels of Intel's recent revelation of their whole 45-nm solution using metal gates and, of all things, hafnium. Pardon the pun, gentle reader, for I am herald to the transition next to darken our doorways.
机译:如果您在七年前告诉我,该行业将考虑在光刻工具(浸入​​193 nm)上花费大约3000万美元,那我会大笑。 5,000万美元的工具(极端紫外线[EUV])甚至更是如此,但是我坐在这里,看着这些数字,不断地惊讶于这个行业将花费,走多长时间以及等待多久,扩展晶体管技术的前沿领域。英特尔最近披露其使用金属栅极以及所有things元素的整个45纳米解决方案之后,我感到非常恼火。双关语,温柔的读者,因为我预示着过渡将使我们的门口变暗。

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