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Bringing Forth Sustainability Innovation in the Electronic Industry: The Case of Lead-Free Solders

机译:在电子行业中培养可持续性创新:无铅焊料的情况

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The structure of university-industry collaboration networks for developing lead-free solders is analyzed with the quantitative methods of social network analysis, based on data on the participants in research and development projects. Initiatives to regulate the use of lead in the United States influenced the formation of university-industry collaboration network for the development and adoption of lead-free solders in Japan. The network promoted cooperation and coordination among the relevant actors, including those working on chip implementation, solders, manufacturing equipment, parts, devices, printed circuit boards, and measurement instruments in implementing an effective transition to lead-free solders. The demonstration of technological progress in Japan in turn encouraged the introduction of a stringent regulation for the phase-out of lead-containing solders in Europe, leading to further formation of networks for technological development and adoption in other regions. Not involved in a domestic institutional network for regulating the use of lead, the university researchers in Japan, working from a relatively neutral position, took the initiative in creating international networks for the formulation of world-wide roadmaps for technological development and implementation, standardization of various specifications, and exchange and sharing of scientific and technological knowledge. This study illustrates that university-industry collaboration networks promoted environmental innovation through global co-evolution of technology and institution.
机译:基于关于研发项目的参与者的数据,分析了用于开发无铅焊料的大学行业合作网络的结构,用于了解无铅焊料。规范美国领导利用的倡议影响了大学行业合作网络的形成,以便在日本的无铅焊料开发和采用。该网络促进了有关行动者之间的合作与协调,包括筹集芯片实施,焊料,制造设备,零件,设备,印刷电路板和测量仪器的人员,在实现对无铅焊料的有效转型中的测量仪器。日本技术进步的证明反过来鼓励引入欧洲含铅焊料淘汰的严格规定,从而进一步形成了在其他地区的技术发展和采用网络。日本的大学研究人员没有参与规范铅的国内机构网络,从相对中立的地位工作,主动创建了国际网络,用于制定全球路线图,以获得技术开发和实施,标准化各种规格,交流和分享科技知识。本研究表明,大学行业合作网络通过技术和机构的全球共同演变推动了环境创新。

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