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Preparation of packaging cap with binary glass microlenses for wafer level packaging of Focal Plane Arrays (FPAs)

机译:焦玻璃微透镜包装帽的制备焦平面阵列的晶圆级包装(FPAS)

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To improve the image resolution of thermal imagers, which image objects by uncooled Focal Plane Arrays (FPAs) made up of two-dimension Infra-red (IR) detector arrays, detector size is decreased, and this results in the reduction of detector IR absorber area . However, reduction of IR absorber area may affect IR detector's sensitivity accordingly. In order to reduce the detector size without reducing the detector's sensitivity, the microlenses which can focus the infrared ray on the IR absorber area need to be prepared. A hot forming process of fabricating binary-optics microlenses for wafer-level-packaging of IR FPAs using Pyrex7740 glass is introduced in the paper. Pyrex7740 glass is a widely-used material in the field of packaging of micro system due to its coefficient of thermal expansion is similar to that of silicon and good optical performance for optical devices. The process is based on etching stepwise structures in silicon, and binary-optics silicon-mold wafer is fabricated by a multilevel reactive-ion etching (RIE), followed by anodic bonding of a thin glass wafer to the etched silicon wafer under vacuum. The bonded wafers are then heated inside a furnace at a temperature above the softening point of the glass, and the glass is blown into the stepwise structure due to the atmospheric pressure. Besides, the filling rate of glass into the silicon cavity mold is also discussed. After the silicon mold is removed, glass packaging caps with wafer-level binary-optics microlenses for vacuum packaging are fabricated. Results show that packaging caps, which are of 620um×620um with focal lengths ranging from 1mm to 100 mm at 2.2 um wavelength, are prepared. While the FPAs are encapsulated by the packaging glass caps, the microlenses combined with the detector concentrate light sufficiently to increase the effective collection area, and IR detector's sensitivity is improved. Due to the excellent transmission efficiency in visible and near IR light of the Py- - rex 7740 glass, the binary-optics microlenses may have potential application in the other optic devices including Light Emitting Diode (LED).
机译:为了提高热成像仪的图像分辨率,由两个尺寸红外线(IR)检测器阵列组成的未冷却焦平面阵列(FPA)的图像对象,降低了检测器尺寸,这导致检测器IR吸收器的减少区域 。然而,IR吸收区域的减少可能相应地影响IR检测器的敏感性。为了减少探测器尺寸而不降低探测器的灵敏度,需要制备能够将红外线聚焦在IR吸收面积上的微透镜。本文介绍了使用Pyrex7740玻璃制造用于IR FPA的晶圆级包装的二元光学微透镜的热成形过程。 Pyrex7740玻璃是一种广泛使用的材料,在微系统的封装领域,由于其热膨胀系数类似于硅和光学器件的良好光学性能。该方法基于蚀刻硅中的逐步结构,并且通过多级反应离子蚀刻(RIE)制造二进制光学硅 - 模晶片,然后在真空下阳极粘接到蚀刻硅晶片。然后将粘合的晶片在炉内在玻璃的软化点的温度下加热在炉内,并且由于大气压,玻璃被吹入逐步结构。此外,还讨论了玻璃填充速率。还讨论了硅腔模具。除去硅模具后,制造具有晶片级二元光学微透镜的玻璃包装盖,用于真空包装。结果表明,制备了620um×620um的包装盖,焦距为1.2μm波长为1mm至100mm。虽然FPA被包装​​玻璃盖封装,但微透镜与探测器集中光充分以增加有效收集区域,并且改善了IR检测器的灵敏度。由于PY- REX 7740玻璃的可见和接近IR光的优异传输效率,二进制光学微透镜可能具有在包括发光二极管(LED)的其他光学器件中的潜在应用。

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