A Study to Performance of Electroplating Solder Bump in Assembly

摘要

The electroplating methodology in assembly is better than the stencil printing manufacturing in pre-WLCSP, (wafer-level chip-scale packaging), especially in quality. Through eight-step process requiring one photolithographic mask; the pre-WLCSP procedures for the electroplating solder' bump technology are able to be completed. Comparing this technology with the electroplating gold bump technology, the cost in "the. previous is more impressive even though the performance of this technology is little lower than the last. Therefore, in this .study, the electroplating solder bump in assembly was probed in detail to analyze the possibility or mass-production.