首页>
外国专利>
Under-bump metallization layers and electroplated solder bumping technology for flip-chip
Under-bump metallization layers and electroplated solder bumping technology for flip-chip
展开▼
机译:凸块下凸点金属化层和电镀焊料凸点技术
展开▼
页面导航
摘要
著录项
相似文献
摘要
A series of improved processes and methods to manufacture solder bumps on the wafer which shrink the space among solder bumps and reduce the cost of manufacturing. A design method and a relevant manufacturing process are introduced to form an organic material or metal material layer, which is called a Bump-Reflow-Control Layer. The pad patterns can be defined by this method. A mechanical part is designed with a hermetic cover to improve the photoresist process. The series of photolithography process including the designing method of related photolithography mask is introduced to achieve the high quality and thick photoresist.
展开▼