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Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points

机译：电镀多层焊料凸块的流体自组装，具有量身定制的变换压印熔点

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Mahsa Kaltwasser; Udo Schmidt; Lars Lösing; Shantonu Biswas; Thomas Stauden; Andreas Bund; Heiko O. Jacobs;
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1. Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points [J] . Mahsa Kaltwasser, Udo Schmidt, Lars L?sing, Scientific reports. . 2019,第1期

机译：电镀多层焊料凸块的流体自组装，具有量身定制的变换压印熔点
2. Core-Shell Transformation-Imprinted Solder Bumps Enabling Low-Temperature Fluidic Self-Assembly and Self-Alignment of Chips and High Melting Point Interconnects [J] . Kaltwasser Mahsa, Schmidt Udo, Biswas Shantonu, ACS applied materials & interfaces . 2018,第47期

机译：核心壳转换印迹焊接凸块，可实现低温流体自组装和芯片的自对准和高熔点互连
3. Effect of electroplating layer structure on shear property and microstructure of multilayer electroplated Sn-3.5Ag solder bumps [J] . Qinghua Zhao, Anmin Hu, Ming Li, Microelectronics & Reliability . 2013,第2期

机译：电镀层结构对多层电镀Sn-3.5Ag焊料凸块的剪切性能和微观结构的影响
4. Interfacial Reaction and Bump Shear Property of Electroplated Sn-37Pb Solder Bump with Ni Under Bump Metallization during Multiple Reflows [C] . Ja-Myeong Koo, Seung-Boo Jung International Conference on Processing Manufacturing of Advanced Materials . 2006

机译：电镀SN-37PB焊料凸起在多重回流期间凸块金属化下电镀SN-37PB焊料凸块的界面反应和凸抗剪切性能
5. Fluxless bonding technology using electroplated multilayer solder structures [D] . Kim, Jongsung 2007

机译：使用电镀多层焊料结构的无助焊技术
6. Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points [O] . Mahsa Kaltwasser, Udo Schmidt, Lars Lösing, -1

机译：具有量身定制的转换烙印熔点的电镀多层焊料凸块的流体自组装
7. Reliability of Electroplated Sn-37Pb Solder Bumps with Different Under Bump Metallizations (UBMs) during High Temperature Storage Test [O] . Ja-myeong Koo, Dea-gon Kim, Seung-boo Jung 2015

机译：高温贮存试验中不同凸点下金属（UBm）电镀sn-37pb焊料凸点的可靠性

Fluidic Self-Assembly on Electroplated Multilayer Solder Bumps with Tailored Transformation Imprinted Melting Points

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