Thermally induced packaging effect of a distributed MEMS phase shifter

摘要

Since radio-frequency microelectromechanial devices work mechanically, they are sensitive to thermally induced packaging effects. These effects will have impacts on their microwave performances and reliability. In this paper, the possible effect of the thermal stress and strain induced in die attaches process on the microwave characteristics of packaged distributed MEMS phase shifters is studied. Theoretical models are established, and full wave electromagnetic simulations are involved. Results show that the thermally induced packaging effect has considerable impact on the phase shift performance of the device.