IC Substrate manufacturing with new Cu plating technologies - (PPT)

摘要

Via filling ability improved with reduction of plated Cu Through hole filling technology soon be available; Filling technology for vias, trenches and pads applicable for new laser embedded circuitization methods; Laser performance improved to match up with through put demands: Removes residues after laser process, Increases roughness to increase the peel strength of plated Cu, Removes weakened base material from heat affection zone, HAZ, (laser process).