SOLDER-DIRECTED SELF-ASSEMBLY BY DIFFERENT-MELTING-POINTS AND CAPILLARY FORCES FOR HIGHLY-INTEGRATED MICROELECTRONICS/MEMS SYSTEMS

摘要

Self-assembly has been widely accepted as the next generation technology of integrating highly dense MEMS/microelectronics systems, in particular for complex and hybrid systems composed of various components. In this paper we demonstrate the use of hybrid self-assembly for integration of different kinds of freestanding micrometer-scale micro-parts onto one common substrate, which is achieved through patterning solders with different melting points to designated binding sites on the substrate, and activating them separately and sequentially. Capillary force of molten solder is used to realize final bonding. We outline the microfabrication process of the substrate and silicon micro-parts and demonstrate this hybrid selfassembly technique.