A Review of Electromigration Under Time Varying Current Stressing-(PPT)

摘要

What is Electromigration? Under steady state DC current conditions (ignoring current crowding effects), the current density throughout a solder interconnect is approximately uniform. Energy from current flow causes solder movement forming voids, depressions and hillocks ultimately resulting in open circuit failure. The rate of failure is related to the current density (A/cm{sup}2) traveling through the solder interconnect.