Metallic Thermal Interface and Die Attach Materials for IGBT Power Semiconductor Modules - (PPT)

摘要

1. Metal bonding materials are well suited for the reliability and thermal requirements of IGBT modules 2. Bonding Materials are commercially available that meet no clean, halogen-free and Pb-free legislation restrictions 3. CTE Matching metal solders are being engineered for IGBT Die Attach and DBC soldering 4. Heat-Spring has been demonstrated as a TIM material with high reliability which can decrease die temperatures by 9°C or more.