Method for measuring sub millimeter wave semiconductor circuits in semiconductor module, involves completely covering thermal conductive plate on top surface of semiconductor component, which is made from dielectric material

摘要

The method involves providing an integrated sub millimeter wave semiconductor circuit in a semiconductor component (1). Electrical pads are provided on bottom side of the semiconductor circuit. A multilayer dielectric carrier film (2) is provided in the semiconductor component. A HF cable structure (3) is connected with the semiconductor component. An arrangement is placed at a top surface of electrical contact surfaces (4). A thermal conductive plate is completely covered on the top surface of the semiconductor component. The semiconductor component is made from dielectric material. An independent claim is also included for a semiconductor module.