首页> 外文会议>Conference on Photomask Technology >Modeling Scanner Signatures in the Context of OPC
【24h】

Modeling Scanner Signatures in the Context of OPC

机译:在OPC背​​景下建模扫描仪签名

获取原文

摘要

The requirement for OPC modeling accuracy becomes increasingly stringent as the semiconductor industry enters sub-0.1um regime. Targeting at capturing the IC pattern printing characteristics through the lithography process, an OPC model is usually in the form of the first principle optical imaging component, refined by some phenomenological components such as resist and etch. The phenomenological components can be adjusted appropriately in order to fit the OPC model to the silicon measurement data. The optical imaging component is the backbone for the OPC model, and it is the key to a stable and physics-centric OPC model. Scanner systematic signatures such as illuminator pupil-fill, illuminator polarization, lens aberration, lens apodization, flare, etc., previously ignored without significant accuracy sacrifice at previous technology nodes, but are playing non-negligible roles at 45nm node and beyond. In order to ensure that the OPC modeling tool can accurately model these important scanner systematic signatures, the core engine (i.e. the optical imaging simulator) of OPC simulator must be able to model these signatures with sufficient accuracy. In this paper, we study the impact on optical proximity effect (OPE) of the aforementioned scanner systematic signatures on several 1D (simple line space, doublet line and doublet space) and 2D (dense line end pullback, isolated line end pullback and T-bar line end pullback) OPC test patterns. We demonstrate that the scanner systematic signatures have significant OPE impact on the level of several nanometers. The predicted OPEs and impact from our OPC simulator matches well with results from an industry standard lithography simulator, and this has laid the foundation of accurate and physics-centric OPC model with the systematic scanner signatures incorporated.
机译:随着半导体工业进入子0.1um制度,OPC建模精度的要求变得越来越严格。靶向通过光刻过程捕获IC图案印刷特性,OPC模型通常是第一原理光学成像组分的形式,由诸如抗蚀剂和蚀刻的一些现象学部件改进。可以适当地调整现象学分量,以将OPC模型适于硅测量数据。光学成像组件是OPC模型的骨干,并且是稳定和物理为中心的OPC模型的关键。扫描仪系统签名,如照明器瞳孔填充,发光仪极化,镜头像差,镜头停止,耀斑等,在未经先前的技术节点上没有显着的精度牺牲,但在45nm节点和超越的情况下正在扮演不可忽略不可忽略的角色。为了确保OPC建模工具可以准确地模拟这些重要的扫描仪系统签名,OPC模拟器的核心发动机(即光学成像模拟器)必须能够以足够的精度模拟这些签名。在本文中,我们研究了上述扫描仪系统签名的影响(简单的线路空间,双层线和双层空间)和2D(密集线末端回调,隔离线末端回调和T-)对光学接近效应(OPE)的影响条线终端回调)OPC测试模式。我们证明扫描仪系统签名对几纳米的水平具有显着的ope影响。从业界标准光刻模拟器的结果,预测的OPES和来自我们OPC Simulator的影响良好,这使得这为具有加入系统扫描仪签名的精确和物理为中心的OPC模型。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号