首页> 外文会议>Conference on Photomask Technology; 20070918-21; Monterey,CA(US) >Modeling Scanner Signatures in the Context of OPC
【24h】

Modeling Scanner Signatures in the Context of OPC

机译:在OPC上下文中对扫描仪签名进行建模

获取原文

摘要

The requirement for OPC modeling accuracy becomes increasingly stringent as the semiconductor industry enters sub-0.1um regime. Targeting at capturing the IC pattern printing characteristics through the lithography process, an OPC model is usually in the form of the first principle optical imaging component, refined by some phenomenological components such as resist and etch. The phenomenological components can be adjusted appropriately in order to fit the OPC model to the silicon measurement data. The optical imaging component is the backbone for the OPC model, and it is the key to a stable and physics-centric OPC model. Scanner systematic signatures such as illuminator pupil-fill, illuminator polarization, lens aberration, lens apodization, flare, etc., previously ignored without significant accuracy sacrifice at previous technology nodes, but are playing non-negligible roles at 45nm node and beyond. In order to ensure that the OPC modeling tool can accurately model these important scanner systematic signatures, the core engine (i.e. the optical imaging simulator) of OPC simulator must be able to model these signatures with sufficient accuracy. In this paper, we study the impact on optical proximity effect (OPE) of the aforementioned scanner systematic signatures on several 1D (simple line space, doublet line and doublet space) and 2D (dense line end pullback, isolated line end pullback and T-bar line end pullback) OPC test patterns. We demonstrate that the scanner systematic signatures have significant OPE impact on the level of several nanometers. The predicted OPEs and impact from our OPC simulator matches well with results from an industry standard lithography simulator, and this has laid the foundation of accurate and physics-centric OPC model with the systematic scanner signatures incorporated.
机译:随着半导体行业进入低于0.1um的要求,对OPC建模精度的要求变得越来越严格。为了通过光刻工艺捕获IC图案印刷特性,OPC模型通常采用第一原理光学成像组件的形式,并通过一些现象学组件(例如抗蚀剂和蚀刻)进行精制。可以适当地调整现象学成分,以使OPC模型适合硅测量数据。光学成像组件是OPC模型的基础,并且是建立稳定且以物理为中心的OPC模型的关键。扫描器的系统特征,例如照明器光瞳填充,照明器偏振,透镜像差,透镜变迹,眩光等,以前在以前的技术节点上并没有显着提高精度的情况下被忽略,但在45nm节点及以后的节点上起着不可忽视的作用。为了确保OPC建模工具可以准确地对这些重要的扫描仪系统签名进行建模,OPC模拟器的核心引擎(即光学成像模拟器)必须能够以足够的精度对这些签名进行建模。在本文中,我们研究了上述扫描仪系统签名对几种1D(简单线空间,doublet线和doublet空间)和2D(密集线端回拉,隔离线端回拉和T-)的光学邻近效应(OPE)的影响。条形线末端拉回)OPC测试图案。我们证明了扫描仪的系统特征对几纳米的水平具有显着的OPE影响。我们的OPC仿真器的预测OPE和影响与行业标准光刻仿真器的结果非常吻合,这为结合了系统扫描仪签名的精确且以物理为中心的OPC模型奠定了基础。

著录项

相似文献

  • 外文文献
  • 中文文献
  • 专利
获取原文

客服邮箱:kefu@zhangqiaokeyan.com

京公网安备:11010802029741号 ICP备案号:京ICP备15016152号-6 六维联合信息科技 (北京) 有限公司©版权所有
  • 客服微信

  • 服务号