The Lead-Free Wave Solder Process and Its Effect on Laminates

摘要

The pressure on manufacturers of electronic devices to continually reduce the cost of products has continued, despite the challenges of higher cost lead-free production. In many cases assemblers have been forced to attempt to build the new lead-free assemblies using the same equipment, and without increasing the cost of components and laminates. While many manufacturers have considered reliability data from materials suppliers and independent test houses, many have not considered the reliability impact on their own particular assemblies. This paper discusses the potential effect on the reliability of a lead-free assembly in relation to the laminate used and the process parameters.