Research on the voids generated between tin plating and copper substrate after Annealing (application of tin plating for outer lead of IC) - (PPT)

摘要

Tin finish on copper substrate has the cracks in IMC layer with bending process after anneal for whisker mitigation. But without anneal or without bending, the finish has no cracks. Tin-bismuth finish has same phenomenon. But for whisker mitigation, tinbismuth plating Therefore bismuth is not necessary annealing. Therefore, there is no crack problem.