首页> 外国专利> Copper oxide solids used for plating of substrates, a method of manufacturing the copper oxide solids, and a device for supplying a plating solution to a plating bath

Copper oxide solids used for plating of substrates, a method of manufacturing the copper oxide solids, and a device for supplying a plating solution to a plating bath

机译:用于基材的镀铜固体,制造氧化铜固体的方法,以及用于向电镀浴提供电镀液的装置

摘要

The present invention relates to a copper oxide solid material used for plating a substrate using an insoluble anode. Further, the present invention relates to a method for producing the copper oxide solid. Further, the present invention relates to an apparatus for supplying a plating solution in which a copper oxide solid is dissolved to a plating bath. The copper oxide solid material CS supplied to the plating liquid for plating of the substrate W contains a copper oxide powder and a liquid as a binder for solidifying the copper oxide powder.
机译:本发明涉及一种用于使用不溶性阳极镀衬底的氧化铜固体材料。此外,本发明涉及制备氧化铜固体的方法。此外,本发明涉及一种用于供应镀铜固体溶解在电镀浴中的电镀液的装置。提供给镀铜液的氧化铜固体材料Cs用于镀晶液W包含氧化铜粉末和作为粘合剂的液体,用于固化氧化铜粉末。

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