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Copper oxide solids used for plating of substrates, a method of manufacturing the copper oxide solids, and a device for supplying a plating solution to a plating bath
Copper oxide solids used for plating of substrates, a method of manufacturing the copper oxide solids, and a device for supplying a plating solution to a plating bath
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机译:用于基材的镀铜固体,制造氧化铜固体的方法,以及用于向电镀浴提供电镀液的装置
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摘要
The present invention relates to a copper oxide solid material used for plating a substrate using an insoluble anode. Further, the present invention relates to a method for producing the copper oxide solid. Further, the present invention relates to an apparatus for supplying a plating solution in which a copper oxide solid is dissolved to a plating bath. The copper oxide solid material CS supplied to the plating liquid for plating of the substrate W contains a copper oxide powder and a liquid as a binder for solidifying the copper oxide powder.
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