METHOD OF PRE-PLATING LEAD FRAME OF SEMICONDUCTOR PACKAGE FOR PLATING SIMULTANEOUSLY INNER LEAD PART AND OUTER LEAD PART BY PROVIDING DIFFERENT PLATING SOLUTIONS TO INNER LEAD PART AND OUTER LEAD PART AND APPLYING CURRENT THERETO

摘要

PURPOSE: A method of pre-plating a lead frame of a semiconductor package is provided to plate simultaneously an inner lead part and an outer lead part by providing different plating solutions to the inner lead part and the outer lead part and applying current thereto. CONSTITUTION: An inner lead part and an outer lead part of a metal base material for lead frame corresponding to an inner lead(22) and an outer lead(23) are separated each other by a barrier rib(50). A plurality of porous members(61,62) are in contact with the inner lead part and the outer lead part of the metal base material. A plurality of plating layers(41,42) are formed on the inner lead part and the outer lead part by providing simultaneously different plating solutions to the porous members and applying the current to the porous members.