Hand-held communication and entertainment products continue to dominate the consumer markets worldwide, and with each generation, companies are offering more and more features and/or capability. Even though the actual functionality of the new product offering expands, the customer is expecting each generation to be smaller and lighter that its predecessor. More functionality typically requires additional or more complex electronics and greater memory capacity. Increasing functional capability, however, can adversely impact the products size as well as manufacturing cost. The challenge manufactures face when competing in the world marketplace is to offer a product that will meet all performance and functionality expectations within budget and without increasing product size. This paper will explores a number of system level applications developed within Tessera's Package Engineering Service Laboratories and examine the results of extensive computer modeling as well as review the data compiled from electrical performance and physical stress testing.
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