UPDATED SOLDER FATIGUE LIFE PREDICTION MODELS FOR SnAgCu SOLDER JOINTS

摘要

The life prediction models for SnPb and SnAgCu solder joints have been proposed previously using advanced finite element modeling techniques such as sub-structuring and multi-point constraints. The assumptions were necessary to increase the efficiency of solution with available computing power. With the advances in computing technology, these assumptions are no longer necessary, and more accurate life prediction can be achieved by eliminating most of the modeling assumptions. In this paper, the updated life prediction model parameters for SnAgCu solder joints are presented without the use of sub-structuring and multi-point constraints. All joints for a particular package-board interconnection are modeled as having non-linear properties. In addition, mesh independent life prediction model parameters are determined using double power law and hyperbolic Sine creep equations for Sn3.0-4.0Ag0.5Cu.