With the upcoming European ROHS legislation and other global movements to lead-free assembly, the NEMI lead-free rework group investigated and developed lead-free rework processes for medium to high-end computer products. The work concentrated on development of lead-free hot air convection rework for PBGA, CBGA, uBGA and lead-free hand soldering rework for TSOP and 2512 chip components on 93mil and 135mil thick test vehicle boards. Lead-free and tin-lead rework profiles along with visual and X-ray inspection will be presented and discussed. The lead-free and tin-lead rework was completed successfully and test boards were submitted for ATC reliability testing for up to 6,000 cycles from 0°C to 100°C which is ongoing at this time.
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