Interferometric measuring microscopy applied to miniature machines, structures, and surface features

摘要

MEMS are complex microstructures such as data storage read-write heads, accelerometers, ink jet printer heads, sensors and micro-mirror arrays. Typically, measuring microscopes control and monitor MEMS fabrication, including the silicon micro-machining process. Metrology tools measure a wide variety of devices at various stages of device fabrication, including wafer, die, and packaged-level, and require flexibility and automation to meet the varied needs of R&D and production [1]. The large diversity of devices, materials, and processes, and the wide range of surface parameters create unique challenges for MEMS metrology tools. The physical dimensions and geometries of MEMS encompass a large range, from tens of millimeters down to the angstrom level. Ideally, surface characterization yields quantitative information over a variable field-of-view covering the x, y and z dimensions. Additional procedures and controls characterize mechanical parameters such as deformations.