Wireless Communications and Broadband technologies are driving the need for advanced laminate materials with improved dielectric properties. This paper focuses on new laminate materials with potential uses in multilayer printed circuit boards (PCBs) for high-speed digital/RF/microwave applications. The objective of this paper is to discuss the resin structure to property relationship of these new materials. The primary focus will be on the interaction of various factors, such as, glass, chemical composition and laminate construction on the dielectric constant and the dielectric loss properties of laminate composites at frequencies in the 2-10 GHz range. This work is focused on epoxy based and non-epoxy based thermoset polymeric resins.
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